As an emerging industry, the LED industry is in the very stage of rapid development. LED die-bond,pitch, heat dissipation and other applications pose new challenges to solder paste. With the help of a variety of alloy Jsissyu has developed a wide range of LED-specific solder pastes for different LED process applications.

LED solder paste features:

1. Halogen-free: According to EN14582 test, Cl≤900PPM, Br≤900PPM, Cl+Br≤1500PPM.

2. No sulfur: according to EN 14582 test, no sulfur element was detected.

3. Strong solderability: Suitable for surface coating of various lead-free circuit boards, including: OSP-Cu, immersion Ag, immersion Sn, ENIG, nickel plating, LF HASL.

Low void rate:the void rate of X-Ray is less than 10%.

Reduce the amount of tin beads: with the reduction of random tin soldering beads, repair times, the first pass yields will increase.

Less residue: less residue after reflow; light color; no corrosion; high impedance; and the probe can be tested.

Excellent repositioning capability: Excellent component repositioning capability can be achieved even in the severe condition for reflow.